Wahyudin, Aziz (2019) Rancang Bangun Sistem PVD (Evaporasi Termal) dan Studi Pemanasannya terhadap Efektivitas Penumbuhan Lapisan Tipis Logam. Sarjana thesis, Universitas Brawijaya.
Abstract
Permukaan QCM yang telah dietsa untuk meningkatkan performa sensitivitasnya perlu diberi elektroda. Karena di Jurusan Fisika UB belum pernah dilakukan penelitian penumbuhan lapisan tipis logam untuk elektroda QCM, maka penelitian ini dilakukan untuk merancang sistem PVD (evaporasi termal) yang dapat digunakan untuk menumbuhkan lapisan tipis logam untuk elektroda QCM dan mempelajari pemanasan sistem yang telah dirancang terhadap efektivitas penumbuhan lapisan tipis logam. Tahapan penelitian dilakukan dengan mendesain dan membuat sistem PVD (evaporasi termal); menguji kemampuan vakum dan kemampuan pemanasan sistem; dan mencoba mendeposisi bahan target Aluminium foil dan kawat solder ke substrat kaca. Dari sistem PVD (evaporasi termal) yang dirancang, sistem vakum bekerja dengan kemampuan mampu mencapai tekanan 5,05 Pa dengan durasi pemompaan 30 menit. Pada sistem pemanas, elemen pemanas mampu bekerja dengan penyuplaian daya dengan jangkauan pengontrolan arus sebesar 5 A—25 A pada tiga variasi elemen pemanas, elemen pemanas 5 substrat Molibdenum, elemen pemanas 6 substrat Molibdenum, dan elemen pemanas 7 substrat Molibdenum. Suhu elemen pemanas saat disuplai arus sebesar 25 A pada elemen pemanas yang teridir dari 5 substrat Molibdenum sebesar 850, 09 °C, pada elemen pemanas 6 substrat Molibdenum sebesar 752,20 °C, dan pada elemen pemanas 7 substrat Molibdenum sebesar 676,18 °C. Deposisi lapisan tipis dengan target kawat solder berhasil dilakukan dan diduga lapisan tipis yang terbentuk merupakan lapisan tipis Timbal dengan nilai konduktivitas 0,62 Ω-1 m-1. Deposisi lapisan tipis dengan target Aluminium foil tidak berhasil dilakukan, selain itu elemen pemanas justru menguapkan unsur/molekul volatil yang dikandungnya sehingga terbentuk lapsian tipis didominasi Karbon, Oksigen, dan Silikon.
English Abstract
QCM surface that had been etched with plasma to improve its sensitivity performance needs to be given its electrodes back. Since there has never been any research on the growth of metallic thin film for QCM electrodes in The Physics Department of Brawijaya University, this research was carried out to design a PVD (thermal evaporation) system that can be used to grow a metallic thin film for QCM electrodes and to study the heating system of PVD (thermal evaporation) system for the effectiveness of metallic thin film growth. Stages of research carried out by designing and making PVD (thermal evaporation) systems; test the vacuum capability and system heating capability and try to deposit the Aluminum foil target material and solder wire onto the glass substrate. From the designed PVD (thermal evaporation) system, the vacuum system works with the ability to reach a pressure of 5.05 Pa with a pumping duration of 30 minutes. In heating systems, heating elements can work with a power supply with a current control range of 5 A—25 A on three variations of heating elements, heating elements 5 Molybdenum substrates, heating elements 6 Molybdenum substrates and heating elements 7 Molybdenum substrates. The temperature of the heating element when supplied with a current of 25 A on the heating element consisting of 5, Molybdenum substrates is 850,09 °C, on the heating element consisting of 6, is 752,20 °C, and on the heating element consisting of 7, is 676,18 °C. The deposition of a thin layer with a target solder wire was successfully carried out and it was thought that the thin layer formed is a Lead thin film with a conductivity value of 0.62 Ω-1 m-1. The deposition of Aluminum thin film was not successful, other than that the heating element instead evaporated its volatile elements/molecules so that it formed a thin layer dominated by Carbon, Oxygen, and Silicon.
Other obstract
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| Item Type: | Thesis (Sarjana) |
|---|---|
| Identification Number: | SKR/MIPA/2019/363/052001518 |
| Uncontrolled Keywords: | PVD (evaporasi termal), lapisan tipis logam, Aluminium, Timah, Timbal, tekanan vakum, daya pemanasan, suhu pemanasan. PVD (thermal evaporation), Metallic thin film, Aluminum, Lead, Tin, vacuum pressure, heating power, heating temperature. |
| Subjects: | 500 Natural sciences and mathematics > 546 Inorganic chemistry > 546.3 Metals, metallic compounds, alloys |
| Divisions: | Fakultas Matematika dan Ilmu Pengetahuan Alam > Fisika |
| Depositing User: | Budi Wahyono Wahyono |
| Date Deposited: | 10 Aug 2020 07:40 |
| Last Modified: | 10 Aug 2020 07:40 |
| URI: | http://repository.ub.ac.id/id/eprint/179906 |
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