Purwandani, Febrina Puji (2019) Analisis Pengendalian Kualitas Dengan Menerapkan Metode Six Sigma Pada Produk Wafer Go! Jumbo Chocolate (Studi Kasus Di Pt Siantar Top, Tbk). Sarjana thesis, Universitas Brawijaya.
Abstract
PT Siantar Top, Tbk merupakan salah satu perusahaan nasional yang bergerak di bidang pangan dengan hasil produk berupa makanan ringan, salah satunya wafer Go! Jumbo Chocolate. Berdasarkan data historis perusahaan selama bulan April – September 2018, masih banyak ditemukan beberapa jenis defect pada produk. Maka, diperlukannya tindakan perbaikan untuk meningkatkan kualitas dari proses produksi wafer Go! Jumbo Chocolate. Tindakan perbaikan pada proses produksi dilakukan dengan menggunakan metode analisis Six Sigma (DMAIC). Tahap pertama (define) menjelaskan alur proses produksi, menentukan Critical-to-Quality (CTQ) beserta faktor yang mempengaruhinya, dan mengidentifikasikan jenis defect yang muncul. Tahap measure melakukan pengukuran pada tingkat proses, identifikasi faktor kunci dengan diagram pareto, pengukuran tingkat output dengan peta kendali X ̅ − S, pengukuran Defect per Million Opportunities (DPMO), sigma level, dan kapabilitas proses. Tahap analyze dilakukan dengan menggunakan bantuan diagram sebab-akibat. Terakhir, tahap improve dilakukan dengan metode yang sesuai untuk memperbaiki permasalahan yang ditemukan. Pada tahap define, setelah mendefinisikan tahap produksi dan menentukan Critical-toQuality (CTQ) yang berkaitan dengan jenis defect beserta faktor yang mempengaruhi CTQ tersebut, kemudian mengidentifikasi jenis defect yang kemungkinan muncul. Tahap measure melakukan pengukuran tingkat proses pada bulan April 2019 dan ditemukan 3 jenis defect pada sampel produk, yakni panjang tidak sesuai standar 30 pieces, berat base tidak sesuai standar 37 pieces, dan berat total wafer tidak sesuai standar 114 pieces. Lalu, pemilihan faktor kunci dengan diagram pareto menghasilkan panjang wafer dipengaruhi oleh homogenitas visual cutting, berat base wafer oleh temperatur adonan, dan berat total wafer oleh homogenitas isi krim dan visual cutting, kemudian dilakukan pengukuran tingkat output dengan peta kendali X ̅ − S, perhitungan Defect per Million Opportunities (DPMO) yang memperoleh nilai 57.460,3175 dan sigma level sebesar 3,1484, serta pengukuran indeks kapabilitas proses dengan hasil 1,0495. Pada tahap analyze, dilakukan dengan menggunakan diagram sebab-akibat pada masing-masing faktor kunci ditinjau dari aspek manusia, mesin, material, dan metode. Berdasarkan hasil analisis dan diskusi dengan pihak perusahaan, maka ditentukan bahwa faktor manusia dan metode yang menjadi fokus untuk dibawa ke tahap improve karena melihat tingkat kepentingan dan keparahannya. Di tahap improve dilakukan preventive maintenance dengan penentuan interval waktu dilakukannya perawatan rutin dengan pisau cutting setiap 681,44 jam, sensor cutting setiap 794,70 jam, kondensor setiap 1.852,27 jam, dan penggantian seal pompa filler setiap 2.019,39 jam, menambahkan 2 mesin Air Conditioner (AC) untuk membantu proses aging adonan, memperbaharui rentang spesifikasi produk dengan panjang wafer menjadi 11,8-12,1 cm, berat base wafer 3,5-3,8 gram, dan berat total wafer 10,6-10,8 gram, mengadakan pelatihan karyawan maintenance secara bertahap, dan penyusunan daftar riwayat preventive maintenance dan breakdown mesin
English Abstract
PT Siantar Top, Tbk is one of the national companies engaged in the field of food products in the form of snacks, one of which is Go! Jumbo Chocolate. Based on historical company data from April to September 2018, there are still many types of defects found in the product. Therefore, it is necessary to take corrective actions to improve the quality of the production process of wafer Go! Jumbo Chocolate. Corrective actions in the production process are carried out using the Six Sigma analysis method (DMAIC). The first phase (define) explains the flow of the production process, determines Critical-to-Quality (CTQ) along with the factors that influence it, and identifies the types of defects that arise. The measure phase takes measurements at the process level, identifies key factors with pareto diagram, measures the output level with the �̅ − � control chart, measures Defect per Million Opportunities (DPMO), sigma level, and process capability. The analyze phase is done using the help of a cause-effect diagram. Finally, the improve phase is carried out with an appropriate method to fix the problems found. In the define phase, after defining the production stages and determining the Criticalto-Quality (CTQ) and the factors that influence the CTQ, then identify the type of defects that is likely to arise. The measure phase commits a measurement at the level process in April 2019 and found three types of defect in product sample, consist of 30 pieces not according to the length standard, 37 pieces not according to the base weight standard, and 114 pieces not according to the total weight standard. Then, the selection result of key factors with pareto diagrams shows that wafer length influenced by visual homogeneity of cutting, wafer base weight influenced by dough temperature, and wafer total weight influenced by visual homogeneity of cutting and homogeneity of cream contents, then measuring the output level with �̅ − � control chart, the calculation of Defect per Million Opportunities (DPMO) which obtained a value of 57.460,3175 and a sigma level of 3,1484, also a measurement of the process capability index which obtained a value of 1.0495. In the analyze phase, it is carried out by using cause-effect diagrams on each key factors in terms of human, machine, material, and method aspects. Based on the results of the analysis and discussion with the company, it was determined that the human and methods aspects that were the focus to be taken to the improve phase due to their importance and severity. In the improve phase, preventive maintenance is carried out by determining the time interval for routine maintenance with the cutting blade every 684.87 hours, cutting sensors every cutting sensors every 814.75 hours, condenser every 847.16 hours, and replacement of the filler pump seal every 1,588.73 hours, adding 2 pieces of Air Conditioner (AC) to help the aging process of the dough, renewing the range of product specifications with wafer length to 11,8- 12,1 cm, wafer base weight to 3,5-3,8 grams, and wafer total weight to 10,6-10,8 grams, providing gradually training for maintenance employees, and compiling a list of preventive maintenance and engine breakdown history.
Other obstract
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| Item Type: | Thesis (Sarjana) |
|---|---|
| Identification Number: | SKR/FT/2019/1001/052000392 |
| Uncontrolled Keywords: | Makanan Ringan, Pengendalian Kualitas, Six Sigma, Preventive Maintenance, Snacks, Quality Control, Six Sigma, Preventive Maintenance |
| Subjects: | 600 Technology (Applied sciences) > 658 General management > 658.5 Management of production > 658.56 Product control, packaging; waste control and utilization > 658.562 Quality control |
| Divisions: | Fakultas Teknik > Teknik Industri |
| Depositing User: | Nur Cholis |
| Date Deposited: | 12 Nov 2020 04:43 |
| Last Modified: | 24 Oct 2021 14:58 |
| URI: | http://repository.ub.ac.id/id/eprint/178279 |
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