Mukti, AyuMardyaning (2014) Pendekatan Metode Lean Six Sigma Untuk Pengendalian Kualitas Proses Produksi Wafer (Studi Kasus Di Pt. Siantar Top, Tbk. Waru-Sidoarjo). Magister thesis, Universitas Brawijaya.
Abstract
Kualitas dapat diartikan sebagai gambaran dan karakteristik menyeluruh dari barang atau jasa yang menunjukkan kesesuaian penggunaan atau pemenuhan harapan pelanggan. Pengendalian kualitas merupakan suatu sistem proses yang dirancang agar dapat menjaga kualitas produk (barang atau jasa) hingga mencapai tingkat kualitas yang diharapkan. Masalah yang sering dihadapi dalam pengendalian kualitas produk, termasuk produk wafer di PT. Siantar Top, Tbk. adalah terjadinya cacat produk. Tujuan penelitian ini yaitu untuk mengetahui seluruh aktivitas yang meliputi aktivitas bernilai tambah, aktivitas tidak bernilai tambah, dan aktivitas tidak bernilai tambah tetapi diperlukan di dalam proses produksi wafer; mengetahui pemborosan (waste) yang timbul dalam proses produksi wafer; mengetahui nilai Defect per Million Opportunities (DPMO), nilai sigma, dan indeks kapabilitas proses produksi wafer; dan mengetahui faktor-faktor yang menyebabkan cacat produk dalam proses produksi wafer berdasarkan analisis diagram sebab akibat dan Failure Mode and Effect Diagram (FMEA). Metode yang digunakan dalam penelitian ini adalah deskriptif kuantitatif dengan pendekatan Lean Six Sigma. Lean Six Sigma bertujuan untuk mengeliminasi pemborosan dan mengurangi siklus waktu pada proses sekaligus mengurangi variasi serta meningkatkan proses. Tahapan Lean Six Sigma yang dilaksanakan meliputi define, measure, dan analyze. Aktivitas dalam proses produksi terdiri atas 55,769% aktivitas yang memberikan nilai tambah atau Value Added Activity (VAA), 9,615% aktivitas yang tidak memberikan nilai tambah atau Non Value Added Activity (NVAA), dan 34,615% merupakan aktivitas yang tidak memberikan nilai tambah tetapi diperlukan atau Necessary but Non Value Added Activity (NNVAA). Pemborosan (waste) terjadi pada tipe environmental, health, and safety (E), defect (D), waiting (W), transportation (T), inventory (I), motion (M), dan excess processing (E). Nilai Defect per Million Opportunities (DPMO) pada proses produksi wafer sebesar 139712,32 dengan nilai sigma sebesar 2,58 dan indeks kapabilitas proses (Cp) sebesar 0.8602877. Faktor-faktor yang menyebabkan terjadinya cacat produk adalah mesin (feeding baking terisi adonan wafer dengan jumlah yang tidak stabil; filler krim coklat bekerja tidak stabil; dan sensor cutting kurang peka); material (adonan tidak standar); manusia (operator kurang peka terhadap setting ulang dan karakter mesin serta operator kurang teliti terhadap Work Order (WO) dari Research and Development (R & D); dan metode (metode pengolahan kurang tepat). Berdasarkan analisis Failure Mode and Effect Diagram (FMEA), mode kegagalan yang menduduki peringkat 1 adalah feeding baking terisi adonan wafer dengan jumlah yang tidak stabil dengan nilai RPN tertinggi yaitu sebesar 270.
English Abstract
Quality can be interpreted as overview and entire characteristic of goods or services that shows suitability of using or compliance with customer expectations. Quality control is a process system designed to maintain quality of product (good or service) up to level of quality expected. Problem often encountered in products quality control, including wafer products in PT. Siantar Top, Tbk. was product defects. objectives of this research were to know entire activities included value added activity; , Non Value Added Activity, and Necessary but Non Value Added Activity; to know waste occurred in wafer production process; to know Defect per Million Opportunities (DPMO) value, sigma value, and process capability index of wafer production; and to know factors that caused product defects on wafer production process based on causal diagram and Failure Mode and Effect Diagram (FMEA) analysis. method used in this research was quantitative descriptive by Lean Six Sigma approach. Lean Six Sigma aims to eliminate waste and reduce cycle time at once reduce variation and improve process. Lean Six Sigma stages were implemented consisted of define, measure, and analyze. Activities in production process consisted of 55.769% of activities that gave value added or Value Added Activity (VAA), 9.615 % activities that did not give value added or Non Value Added Activity (NVAA), and 34.615 % was activities that did not give value added but necessary or Necessary but Non-Value Added Activity (NNVAA). waste occurred in environmental, health, and safety (E), defect (D), waiting (W), transportation (T), inventory (I), motion (M), dan excess processing (E) type. Defect per Million Opportunities (DPMO) value for wafer production process was 139,712.32 with sigma value was 2.58 and process capability index (Cp) was 0.8602877. factors that caused product defects were machine (baking feeding filled wafer dough with an unstable number; chocolate cream filler was unstable, and cutting sensor was less sensitive); material (dough was not standard); humans (operators were less sensitive to set again and engine character and operators were less scrupulous to Work Order (WO) of Research and Development (R&D), and methods (processing method was less precise). Based on Failure Mode and Effect Diagram (FMEA) analysis, failure mode which first rank was baking feeding filled wafer dough with an unstable number with highest RPN value was 270.
| Item Type: | Thesis (Magister) |
|---|---|
| Identification Number: | TES/658.56/MUK/p/041402578 |
| Subjects: | 600 Technology (Applied sciences) > 658 General management > 658.5 Management of production |
| Divisions: | S2/S3 > Magister Teknik Industri Pertanian, Fakultas Teknologi Pertanian |
| Depositing User: | Budi Wahyono Wahyono |
| Date Deposited: | 14 May 2014 08:14 |
| Last Modified: | 14 May 2014 08:14 |
| URI: | http://repository.ub.ac.id/id/eprint/159794 |
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